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JwalinNano Second Laser

IR Nanosecond Laser Series

High Pulse Energy 1064nm Infrared Laser for Precision Material Processing

The IR Nanosecond Laser Series is a high pulse energy infrared laser platform operating at 1064nm and available in power configurations from 50W to 150W. Designed for advanced industrial processing applications, it delivers exceptional beam quality, high peak power, and outstanding stability. The laser enables precision machining of ceramics, semiconductor materials, carborundum, and thermosensitive materials while minimizing thermal effects, deformation, and material damage. Its robust industrial design makes it ideal for continuous manufacturing and research environments requiring reliable, high-accuracy laser processing.

Laser TypeIR Nanosecond Laser
Wavelength1064nm
Available Power50W / 100W / 150W
Processing TechnologyHigh Pulse Energy

Industries Served

Semiconductor IndustryElectronics ManufacturingCeramics IndustryIndustrial AutomationPrecision EngineeringResearch LaboratoriesAdvanced ManufacturingPhotonics Industry
Product Features
1064nm Infrared Laser Technology
High Pulse Energy Output
Available in 50W, 100W and 150W Models
Excellent Beam Quality
No Heat Affected Zone
No Material Deformation
No Processing Pollution
High Precision Material Processing
Industrial Grade Reliability
Long Service Life
Stable Output Performance
Continuous Industrial Operation
Technical Specifications
Product Type
IR Nanosecond Laser
Laser Series
IR Nanosecond Laser Series
Wavelength
1064nm
Available Power
50W / 100W / 150W
Pulse Type
Nanosecond
Technology
High Pulse Energy
Beam Quality
Industrial Precision Grade
Cooling Method
Industrial Cooling System
Operation Mode
Continuous Operation
Processing Quality
No Heat Affected Zone
Material Compatibility
Ceramics, Semiconductor, Carborundum, Thermosensitive Materials
Application
Precision Material Processing
Applications
Ceramics Processing

Provides high-precision machining and structuring of advanced ceramic materials.

Semiconductor Material Processing

Suitable for precision processing of semiconductor wafers and electronic materials.

Carborundum Cutting

Enables accurate cutting and machining of silicon carbide and related materials.

Thermosensitive Material Cutting

Processes heat-sensitive materials with minimal thermal damage.

Precision Manufacturing

Supports industrial production requiring high accuracy and clean processing.

Scientific Research

Used in laboratories and research facilities for advanced laser applications.

Key Benefits
01

No Material Damage

High pulse energy processing minimizes unwanted material damage.

02

No Heat Affected Zone

Reduces thermal influence and preserves material properties.

03

No Deformation

Maintains dimensional accuracy during processing.

04

Clean Processing Results

Produces high-quality cuts without contamination or pollution.

05

High Precision Performance

Supports demanding industrial and scientific applications.

06

Reliable Industrial Operation

Designed for stable, long-term performance in production environments.