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JwalinFemto Second Laser

UV Femtosecond Laser

343nm Ultrafast Laser for Semiconductor, OLED and Precision Material Processing

The UV Femtosecond Laser is an ultrafast laser source operating at 343nm with power options ranging from 5W to 50W. Featuring pulse widths from 500fs to 10ps and excellent beam quality of M² < 1.1, it enables cold material processing with virtually no heat affected zone. The laser is ideal for OLED cutting, semiconductor wafer processing, film cutting, flexible circuit manufacturing, and precision machining of low dielectric constant materials where exceptional accuracy and minimal thermal damage are required.

Wavelength343nm
Available Power5W - 50W
Pulse Width500fs - 10ps
Beam QualityM² < 1.1

Industries Served

Semiconductor IndustryDisplay ManufacturingElectronics ManufacturingFlexible ElectronicsResearch LaboratoriesPhotonics IndustryPrecision EngineeringAdvanced Manufacturing
Product Features
343nm UV Femtosecond Technology
5W to 50W Power Range
500fs to 10ps Pulse Width
Excellent Beam Quality M² < 1.1
Cold Material Processing
Ultra-High Precision Machining
Minimal Heat Affected Zone
Virtually No Material Deformation
High Stability Output
Industrial Grade Reliability
Long Service Life
Advanced Semiconductor Processing
Technical Specifications
Product Type
UV Femtosecond Laser
Wavelength
343nm
Available Power
5W - 50W
Pulse Width
500fs - 10ps
Beam Quality
M² < 1.1
Processing Method
Ultrafast Cold Processing
Laser Technology
Femtosecond Laser
Output Stability
High Stability
Application Type
Micro Machining & Semiconductor Processing
Operation Mode
Industrial Continuous Operation
Applications
OLED Cutting

Provides precision cutting of OLED display materials.

Semiconductor Wafer Cutting

Supports high-accuracy wafer dicing and processing.

Film and Foil Cutting

Enables burr-free cutting of thin materials.

Flexible Circuit Processing

Ideal for FPC and flexible electronics manufacturing.

Low Dielectric Material Processing

Suitable for advanced electronic substrate processing.

Precision Micromachining

Supports ultra-fine industrial manufacturing applications.

Key Benefits
01

Cold Processing Technology

Minimizes thermal damage to sensitive materials.

02

Exceptional Precision

Produces extremely fine and accurate machining results.

03

Reduced Material Stress

Prevents cracking, deformation, and thermal distortion.

04

Superior Edge Quality

Creates clean and smooth processing results.

05

High Production Efficiency

Supports advanced high-speed manufacturing.

06

Reliable Industrial Performance

Designed for continuous operation in demanding environments.