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Green Femtosecond Laser - image 1
JwalinFemto Second Laser

Green Femtosecond Laser

515nm Ultrafast Laser for Medical Devices, FPC and Wafer Processing

The Green Femtosecond Laser operates at 515nm with output power ranging from 10W to 100W. Featuring pulse widths from 500fs to 10ps and beam quality of M² < 1.2, it provides exceptional processing precision and minimal thermal effects. The laser is optimized for polymer cutting, flexible circuit processing, integrated circuit packaging, wafer cutting, and medical device manufacturing applications.

Wavelength515nm
Available Power10W - 100W
Pulse Width500fs - 10ps
Beam QualityM² < 1.2

Industries Served

Medical Device ManufacturingSemiconductor IndustryElectronics ManufacturingFlexible ElectronicsPrecision EngineeringPhotonics IndustryResearch LaboratoriesAdvanced Manufacturing
Product Features
515nm Green Femtosecond Technology
10W to 100W Power Range
500fs to 10ps Pulse Width
Excellent Beam Quality M² < 1.2
Ultra-Precise Material Processing
Cold Ablation Technology
Minimal Thermal Impact
High Speed Processing
Stable Output Performance
Industrial Grade Design
Long Operational Life
Advanced Manufacturing Capability
Technical Specifications
Product Type
Green Femtosecond Laser
Wavelength
515nm
Available Power
10W - 100W
Pulse Width
500fs - 10ps
Beam Quality
M² < 1.2
Processing Method
Ultrafast Cold Processing
Laser Technology
Femtosecond Laser
Output Stability
High Stability
Application Type
Precision Industrial Processing
Operation Mode
Continuous Industrial Operation
Applications
Polymer Cutting

Provides precision machining of polymer materials.

FPC Cutting

Supports flexible printed circuit manufacturing.

Integrated Circuit Packaging

Enables precise IC cutting and packaging operations.

Wafer Cutting

Suitable for semiconductor wafer processing.

Medical Device Manufacturing

Supports precision fabrication of medical components.

Thin Metal Foil Processing

Provides cutting and deformation of delicate metallic materials.

Key Benefits
01

Ultra-High Precision

Enables micron-level processing accuracy.

02

Low Thermal Damage

Protects delicate materials during machining.

03

Excellent Surface Quality

Produces clean and smooth finished surfaces.

04

Versatile Material Compatibility

Suitable for polymers, metals, and semiconductor materials.

05

Improved Production Efficiency

Supports advanced manufacturing processes.

06

Reliable Long-Term Operation

Engineered for industrial environments.