End Pump Laser Source MMEPG-532-20-HE-D30
532nm High Peak Power End Pump Laser Source for Diamond & Hard Material Processing
The End Pump Laser Source MMEPG-532-20-HE-D30 delivers an even higher peak power output at 532nm, enabling greater processing capability and efficiency, particularly for cutting ultra-hard materials such as silicon carbide and diamond. The laser system is highly integrated, combining the laser, power supply, Q-switching control, and protection circuits into a compact and easy-to-install unit that simplifies maintenance. Its internal resonator cavity features a self-cleaning system and stable cavity design, addressing power attenuation issues and ensuring an extended service life.
Industries Served
Product Features
Technical Specifications
Applications
Provides high peak power output for precision diamond slicing and coring operations.
Suitable for 4P processing of diamonds 4mm and above, requiring stable high-energy pulses.
Delivers stable beam performance for cutting carbon fiber composite materials.
Enables precise dicing of silicon carbide wafers for semiconductor applications.
Ideal for processing ultra-hard materials requiring high peak power and beam stability.
Key Benefits
Greater Processing Capability
Higher peak power improves efficiency when cutting ultra-hard materials.
Compact Integrated Design
Combines laser, power supply, Q-switch control, and protection circuits in one unit.
Extended Service Life
Self-cleaning resonator cavity addresses power attenuation for long-term reliability.
Stable Beam Performance
Stable cavity design ensures consistent pulse energy and beam quality.
Simplified Maintenance
Highly integrated construction facilitates easy installation and servicing.
Reliable Industrial Operation
Water-cooled design supports continuous industrial-grade performance.